||This study utilizes sputter of the physics way (Physical Vapor Deposition, PVD) to plate in vacuum. Let conduct metal particle of copper and stainless steel deposits and accumulates on chassis structure of the non-conducting plastic, the function of making this plastic chassis have being protected electromagnetic interference, it would cooperate with this research in the peculiar structure of chassis design; not only make the plastic chassis surface to form continuous electric conduction layer, It can also be under not influencing the prerequisite of the whole intensity of the system. The whole project's development has cost reducing relevant electromagnetic interference protecting, show the innovation that the relevant product designs.|
While studying, it designs the concept and comparative project of experiment into the products, and will appear and correlated with designing in the note type computer chassis actually. The different preventing and curing processes have compared for electromagnetic interference protecting, propose the advantage and expansionary of this research. It proves that can offer the organization solution of the industry to design tactics in this.
Standardize the inspection specification of the grade via world finally. Study the system and carry on the electromagnetic interference protecting and examining to the experiment. To confirm it reaches the electromagnetic compatibility standard, and then through the relevant mechanical destructiveness and non- destructive of the system experiment. The guarantee the organization designs the reliability of the design tactics, so as to finish the real products and appear as the final research results.
|| Craig A. Grimes, Dale M. Grimes, “A Brief Discussion of EM1 Shielding|
Materials”, p.220~223, IEEE, (1993)
 USPTO, United States Patent and Trademark Office
 James Lindsay White, Principles of polymer engineering rheology,
Edition: 2, pp.49~53, (1990)
 Jay Amarasekera, “Conductive plastics for electrical and electronic
applications”, GE Advanced Materials/LNP explains, REINFORCED
 George M. Kunkel, “Shielding Theory and Practice”, Page:4.2.1/1-4.2.1/5
, IEEE, (1992)
 R. M. Gresham,”EMI/RFI Shielding of Plastic” Plating and Surface
Finishing, p. 63-69, IEEE, (1988)
 L.G. Bhatgadde, S. Joseph,” Electroless Techniques for EMI Shieldings”,
Advanced Centre for Research in Electronics, Indian Institute of
Technology, IEEE, (1997)
 International Electro-technical Commission (IEC), International
Special Committee on Radio Interference (CISPR),
 Tim Williams, EMC for product designers, (2001), 李迪、王培清 譯，
 A.K. Ghose and G.K. Deb, “Notebook Computer and low EMI
Approach”, Electronics Research & Development Centre of India,
Calcutta, IEEE, (2006)
 剛村迪夫，淺談電磁干擾，p. 89-98，全華科技圖書股份有限公
 Teijin chemicals LTD. Plastic technique and research center.
 有方廣洋 著，毆陽渭城 譯，射出成型的不良對策，全華科技圖書
 Paul C. Burton,” Joining of Two Technologies: Wire mesh - plastic to
produce shielded plastic enclosures”, IEEE, (1999)
 Richard B. Schulz, V.C. Plantz, and D.R. Brush, “Shielding Theory
and Practice”, IEEE Transactions on electromagnetic compatibility,
VOL. 30, NO. 3, August 1988
 D Mohr, IEC TC77 EMC: “The United Nations” for EMC, Secretary
General TC77, EMC Europe 2000, 4th European Symposium on EMC,
Brugge, September 11~15 2000
 BSMI, Bureau of Standards, Metrology & Inspection, M.O.E.A.., R.O.C.
 Paragon Technologies Co., Ltd, Business and Research Instruction Thesis.
 IR. P.C. VAN VEGTEN, ACHESON COLLOIDEN B.V.” Shielding
options for plastic enclosures”, IEEE, (1992)
 The European Standard EN 61000-4-2: Electromagnetic compatibility
(EMC) Section 4.2 Electrostatic discharge immunity test- Basic EMC
Publication. 1995., EN55024. 1998, IEC1000-4-2. 1995.
 ASTM D3359-02, American Society for Testing and Materials:
Standard Test Method for Measuring Adhesion by Tape Test.
 ROHM and HAAS Electronic Materials Inc., packaging and finishing
 CCS, Compliance Certification Services Inc. (2008)