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Student Number 963303027
Author Chen-Hsiang Jao(饒振祥)
Author's Email Address No Public.
Statistics This thesis had been viewed 1190 times. Download 10 times.
Department Executive Master of Mechanical Engineering
Year 2008
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title Study for the Inner Surface of Plastic Chassis is Dealt with to Electromagnetic Interference Protecting and the Structure Building
Date of Defense 2009-07-03
Page Count 92
Keyword
  • EMI
  • Plastic Chassis
  • Abstract This study utilizes sputter of the physics way (Physical Vapor Deposition, PVD) to plate in vacuum. Let conduct metal particle of copper and stainless steel deposits and accumulates on chassis structure of the non-conducting plastic, the function of making this plastic chassis have being protected electromagnetic interference, it would cooperate with this research in the peculiar structure of chassis design; not only make the plastic chassis surface to form continuous electric conduction layer, It can also be under not influencing the prerequisite of the whole intensity of the system. The whole project's development has cost reducing relevant electromagnetic interference protecting, show the innovation that the relevant product designs.
    While studying, it designs the concept and comparative project of experiment into the products, and will appear and correlated with designing in the note type computer chassis actually. The different preventing and curing processes have compared for electromagnetic interference protecting, propose the advantage and expansionary of this research. It proves that can offer the organization solution of the industry to design tactics in this.
    Standardize the inspection specification of the grade via world finally. Study the system and carry on the electromagnetic interference protecting and examining to the experiment. To confirm it reaches the electromagnetic compatibility standard, and then through the relevant mechanical destructiveness and non- destructive of the system experiment. The guarantee the organization designs the reliability of the design tactics, so as to finish the real products and appear as the final research results.
    Table of Content 摘要i
    Abstractii
    目錄iii
    圖目錄iv
    表目錄vii
    第一章緒論1
    1-1 研究背景與動機1
    1-2 各章摘要4
    第二章文獻回顧6
    2-1 塑膠成型與電磁波干擾防護文獻說明6
    2-2 機殼成型與電磁波干擾防護原理12
    2-2-1 塑膠機殼成型設計原理12
    2-2-2塑膠射出機台與成型原理18
    2-2-3電磁波干擾防護理論與架構27
    2-2-4 導電金屬防護層製程原理31
    第三章實驗製作方法與設備38
    3-1  實驗製作方法38
    3-1-1 塑膠機殼內部結構設計38
    3-1-2 塑膠機殼製作46
    3-1-3真空濺鍍導電金屬防護層製作47
    3-2  實驗設備48
    3-2-1 射出成型系統48
    3-2-2 真空濺鍍系統50
    3-2-3 檢測儀器系統與檢驗規範52
    第四章  結果與討論61
    4-1  非破壞性實驗檢測61
    4-1-1 電磁波干擾防護檢驗61
    4-1-2 成膜率電阻值檢驗67
    4-2  破壞性實驗檢測:68
    4-2-1 環境衝擊檢驗結果分析:68
    4-2-2 附著強度檢驗結果分析:70
    4-3不同電磁波干擾防治工法的比較71
    第五章  結論76
    第六章  未來展望78
    參考文獻79
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    [11] International Electro-technical Commission (IEC), International
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       司,台北市,(2004)
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       2007年。
    [16] Teijin chemicals LTD. Plastic technique and research center.
    [17] 洪瑞庭,塑膠加工技術與工程,高立圖書有限公司,台北市,2000
       年。
    [18] 有方廣洋 著,毆陽渭城 譯,射出成型的不良對策,全華科技圖書
       有限公司,台北市,2007年。
    [19] Paul C. Burton,” Joining of Two Technologies: Wire mesh - plastic to
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    [20] Richard B. Schulz, V.C. Plantz, and D.R. Brush, “Shielding Theory
       and Practice”, IEEE Transactions on electromagnetic compatibility,
       VOL. 30, NO. 3, August 1988
    [21] D Mohr, IEC TC77 EMC: “The United Nations” for EMC, Secretary
       General TC77, EMC Europe 2000, 4th European Symposium on EMC,
       Brugge, September 11~15 2000
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       公司,台北市,2005年。
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    [25] IR. P.C. VAN VEGTEN, ACHESON COLLOIDEN B.V.” Shielding
       options for plastic enclosures”, IEEE, (1992)
    [26] The European Standard EN 61000-4-2: Electromagnetic compatibility
       (EMC) Section 4.2 Electrostatic discharge immunity test- Basic EMC
       Publication. 1995., EN55024. 1998, IEC1000-4-2. 1995.
    [27] ASTM D3359-02, American Society for Testing and Materials:
       Standard Test Method for Measuring Adhesion by Tape Test.
    [28] ROHM and HAAS Electronic Materials Inc., packaging and finishing
       technologies. 2007
    [29] CCS, Compliance Certification Services Inc. (2008)
    Advisor
  • Tien-Hsi Li(李天錫)
  • Files
  • 963303027.pdf
  • disapprove authorization
    Date of Submission 2009-07-12

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