Title page for 953901003


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Student Number 953901003
Author Sheng-ping Wang(王勝平)
Author's Email Address wangsp67@yahoo.com.tw
Statistics This thesis had been viewed 1417 times. Download 425 times.
Department Chemical and Materials Engineering
Year 2007
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title A Study on Micro Polishing of scrap wafer by Abrasive Jet Technology
Date of Defense 2008-06-20
Page Count 96
Keyword
  • abrasive jet maching
  • polishing
  • silicon wafer
  • surface roughness
  • Taguchi Method
  • Abstract This research mainly uses the automatic abrasive jet technology and takes scrap wafer surface of the semiconductor factory as an improving target in order to probe into the abrasive jet technology for cleaning scrap wafer surface circuit layer and improve surface polishing effect. This study has two processed steps that can be divided into the rough polishing and micro polishing processing method. First, the study of the rough polishing processing uses the Taguchi Method to obtain the optimization of manufacturing process parameters for scrap wafer surface roughness and remove weight on automatic abrasive jet technology. Second, in the micro polishing processing, the best combination of parameters are used to continue discussing the different of initial silicon wafer surface, machining time and abrasive mesh in turn. Expecting that the silicon wafer surface can be improved like a mirror after automatic abrasive jet technology. From the experimental result, we will find the automatic abrasive jet technology can clean the scrap wafer surface circuit layer effectively and conjugate the best combination of parameters by Taguchi Method, the silicon wafer surface roughness value can drop from 0.14μm Ra to 0.033μm Ra, and the silicon wafer surface is presented the reflection result of the mirror. Furthermore, studying and investigating the silicon wafer surface characteristic of material after the abrasive jet technology we will find that utilizing the SiC abrasive jet technology, the silicon wafer surface has no SiC to insert the surface effect and it does not produce any cracks which is observed by the metalloscope.
    Table of Content 中文摘要---------------------------------------------------------------------------i
    英文摘要--------------------------------------------------------------------------ii
    誌謝--------------------------------------------------------------------------------iv
    目錄---------------------------------------------------------------------------------v
    圖目錄----------------------------------------------------------------------------viii
    表目錄-------------------------------------------------------------------- --------xi
    第一章 緒論-----------------------------------------------------------------------1
    1-1 研究背景----------------------------------------------------------------1
    1-2 研究動機與目的-------------------------------------------------------2
    1-3 研究方法----------------------------------------------------------------4
    1-4 論文架構----------------------------------------------------------------5
    第二章 文獻回顧-----------------------------------------------------------------7
    2-1 矽晶圓片表面拋光探討----------------------------------------------7
    2-2 磨料噴射加工法探討-----------------------------------------------11
    2-3 田口實驗計畫法探討-----------------------------------------------14
    第三章 實驗原理與設備-----------------------------------------------------16
    3-1 磨料噴射加工法基本原理-----------------------------------------16
    3-1-1 磨料噴射技術材料移除機制------------------------------18
    3-2 田口品質工程基本原理--------------------------------------------19
    3-2-1 變異數分析( ANOVA )及F檢定(F-test)----------------27
    3-3 實驗設備--------------------------------------------------------------29
    3-3-1 加工設備------------------------------------------------------29
    3-3-2 量測觀察設備------------------------------------------------32
    3-4 實驗材料--------------------------------------------------------------34
    3-5 實驗流程--------------------------------------------------------------37
    第四章磨料噴射技術應用於報廢矽晶圓表面加工特性探討--------38
    4-1前置實驗---------------------------------------------------------------38
    4-1-1 乾式與濕式加工對報廢矽晶圓表面粗糙度之影響---38
    4-1-2 磨料噴射加工路徑對報廢矽晶圓表面之影響---------40
    4-1-3 磨料噴射時間對報廢矽晶圓表面之影響---------------42
    4-2 實驗條件與田口法實驗規劃--------------------------------------43
    4-2-1研究內容-------------------------------------------------------46
    4-3 田口實驗結果與討論-----------------------------------------------47
    4-3-1 田口品質工程分析------------------------------------------47
    4-3-2 ANOVA分析與F檢定-----------------------------------53
    4-3-3驗證實驗-------------------------------------------------------55
    4-4 磨料噴射技術加工參數因子對報廢矽晶圓品質特性探討--57
    4-4-1 實驗條件與實驗規劃---------------------------------------57
    4-4-2 衝擊角度對報廢矽晶圓質特性之影響------------------59
    4-4-3 加工高度對報廢矽晶圓品質特性之影響---------------61
    4-4-4 氣體壓力對報廢矽晶圓品質特性之影響---------------63
    4-4-5 磨料與添加劑混合比例對報廢矽晶圓品質特性
    之影響---------------------------------------------------------65
    4-4-6 旋轉平台轉速對報廢矽晶圓品質特性之影響---------67
    4-4-7 Table移動速率對報廢矽晶圓品質特性之影響------69
    4-4-8 加工時間對報廢矽晶圓品質特性之影響-------------71
    第五章 磨料噴射技術應用於矽晶圓精微拋光之探討------------------75
    5-1 不同初始矽晶圓表面精微拋光之影響--------------------------75
    5-2 磨料粒徑對矽晶圓表面精微拋光之影響-----------------------81
    5-3 矽晶圓表面特性探討-----------------------------------------------85
    5-3-1 矽晶圓表面成分分析---------------------------------------85
    5-3-2 矽晶圓截面裂痕檢測---------------------------------------87
    5-3-3 磨料噴射加工法表面鏡面拋光結果---------------------88
    第六章 結  論---------------------------------------------------------------91
    參考文獻----------------------------------------------------------------------92
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    Advisor
  • Biing-hwa Yan(顏炳華)
  • Files
  • 953901003.pdf
  • approve in 2 years
    Date of Submission 2008-07-07

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