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Student Number 93333004
Author Ching-chi Yang(楊清奇)
Author's Email Address No Public.
Statistics This thesis had been viewed 956 times. Download 2224 times.
Department Executive Master of Mechanical Engineering
Year 2010
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title A Study of Gold Plating on Electrical Connectors
Date of Defense 2011-07-26
Page Count 66
Keyword
  • Connector
  • Gold Plating
  • Abstract As the longer life cycle and harsher application environment of the industrial automation product, its connector requires higher quality and better performance than other 3C products. Gold plating method is usually used to improve the durability and against the variability of the environment. However, the price of gold has become higher and higher in recent years. It caused a great effect on the connector cost and consequently it had a serious impact on the cost of end products.
    The price of connector is proportional to the thickness of gold plating, so the thickness of gold plating has reduced from 100 μinch in late 1960’s to 1970’s to less than 1 μinch nowadays in order to reduce the cost of connector. However, the porosity of the surface in gold plating coating is contrary to the thickness of gold plating layer. The porosity leads to corrosion on both the substrate material of gold plating coating and cladding exposing in the gas of external environment. This would occur the problems of connection failure or data missing in connector.
    In order to find the relationship between durability and thickness of gold plating, the related test specifications of connector will be introduced in this thesis and the experiments will be conducted based on the specifications. In the end, some conclusions will be presented as the selection of connector coating as well as the reference for future research.
    Table of Content 中文摘要…………..i
    英文摘要Abstractii
    目錄……….....iiii
    表目錄...........v
    圖目錄..............................................................................................................................vi
    第一章、緒論1
    1-1 研究動機1
    1-2 文獻回顧2
    1-3  論文內容2
    第二章、連接器接觸鍍層介紹6
    2-1  端子接觸鍍層簡介6
    2-2  錫與錫合金6
    2-3  金7
    2-4  鍍金規格的分類8
    第三章、鍍金品質的檢驗標準及方法14
    3-1  鍍金品質檢驗標準簡介14
    3-2  純度(Deposit Purity)14
    3-3  硬度(Hardness)14
    3-4  外觀(Appearance)15
    3-5  厚度(Thickness)15
    3-6  附著力(Adhesion)16
    3-7  鍍層完整性(Plating Integrity)16
    3-8  延展性(Ductility)17
    第四章、實驗方法19
    4-1  實驗設計簡介19
    4-2  混合腐蝕氣體試驗(MFG:Mixed Flowing Gas)19
    4-2.1 實驗設計20
    4-2.2 實驗設備21
    4-3  鹽霧測試(Salt Spray Test)21
    4-3.1 實驗設計22
    4-3.2 實驗設備22
    4-4 高溼度的溫度循環(Cycling Temperature with High Humidity)23
    4-4.1 實驗設計23
    4-4.2 實驗設備24
    4-5  實驗試件24
    第五章、實驗結果與討論32
    5-1  簡介32
    5-2  混合腐蝕氣體試驗(Mixed Flowing Gas)實驗結果32
    5-3  鹽霧測試(Salt Spray Test)實驗結果34
    5-4  高溼度溫度循環(Cycling Temperature with High Humidity)實驗結果35
    5-5  不同鍍金厚度之價格比較35
    第六章、結論與未來工作54
    6-1  結論54
    6-2  未來工作55
    參考文獻56
    Reference [1] Goldprice網站http://goldprice.org/gold-price-history.html
    [2] MAX PEEL. (2000), “Gold Flash Contacts : Super Saver or Ticking Time Bomb.”
    [3] Xue-Yan Lin, Ji-Gao Zhang (2002), ”Properties of Corrosion Stainson Thin Gold Plating”, Proceedings of the Forty-Eighth IEEE Holm Conference on, :156- 162.
    [4] Stennett, N.A. (1993), "Failure mechanisms in stationary low current contacts.” Connectors on Vehicles, IEE Colloquium on, : 4/1-4/12.
    [5] 池建明, 王麗娟 (2002), ”連接器鍍金工藝”, 電鍍與塗飾,:34-36.
    [6] MIL-G-45204C (1993), Gold Plating, ELECTRODEPOSITE
    [7] ASTM-B488-01 (2006), Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses.
    [8] ASTM B578 (Standard Test Method for Microhardness of Electroplated Coatings)
    [9] ASTM B765 (Standard Guide for Selection of Porosity and Gross Defect Tests for Electrodeposits and Related Metallic Coatings)
    [10] ASTM B735 (Standard Test Method for Porosity in Gold Coatings on Metal Substrates by Nitric Acid Vapor)
    [11] ASTM B799 (Standard Test Method for Porosity in Gold and Palladium Coatings by Sulfurous Acid/Sulfur-Dioxide Vapor)
    [12] ASTM B489 (Standard Practice for Bend Test for Ductility of Electrodeposited and Autocatalytically Deposited Metal Coatings on Metals)
    [13] EIA-364-D (Electrical Connector /Socket Test Procedures Including Environmental Classifications)
    [14] EIA-364-65A (Mixed Flowing Gas)
    [15] ASTM B845, Standard Guide for Mixed Flowing Gas (MFG) Tests for Electrical Contacts
    [16] EIA-364-TS-1000.01, Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Business Office Applications.
    [17] Yamasaki Seiki Kenkyusho Inc. Mixed Flowing Gas Corrosion Test Cabinet 技術手冊 
    [18] EIA-364-26B, Salt Spray Test Procedure for Electrical Connectors, Contacts and Sockets.
    [19] T-MACHINE鐵木真科技股份有限公司鹽霧測試機技術手冊
    [20] EIA-364-31B, Humidity Test Procedure for Electrical Connectors and Sockets.
    [21] T-MACHINE鐵木真科技股份有限公司恆溫恆濕試驗機技術手冊
    Advisor
  • Shu-San Hsiau(蕭述三)
  • Files
  • 93333004.pdf
  • approve immediately
    Date of Submission 2011-08-26

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