Title page for 93323030


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Student Number 93323030
Author Wei-Chieh Wu(吳瑋榤)
Author's Email Address No Public.
Statistics This thesis had been viewed 2061 times. Download 1238 times.
Department Mechanical Engineering
Year 2005
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title Micro Machining Using Micro-EDM Combined with Electro-codeposition
Date of Defense 2006-07-05
Page Count 75
Keyword
  • Electro-Codeposition
  • Micro-EDM
  • Micro-grinding
  • Micro-grinding-tool
  • Micro-hole
  • Abstract Abstract
    This study presents a novel process of using micro-electro-discharge-machining (micro-EDM) combined with electro-codeposition to fabricate the micro-grinding-tool to machining a micro-hole on high nickel alloy. During the machining process, a micro-grinding-tool is fabricated by wire electro-discharge grinding (WEDG) and electro-codeposition directly by using micro-EDM for machining the micro-hole and by micro-grinding to finish the hole wall.
    The experimental result shows the suitable parameters obtained to fabricating micro-grinding-tool for electro-codeposition are considered to be the following: electric current of 10 mA, hole diameter of positive ring is 5 mm, SiC particle size of 4μm, SiC particle concentration of 10 g/L, rotational speed of 15 rpm and CTAB of 150 ppm. By this method, The micro-grinding-tool will provided with smoothness surface on coating layer, uniform particle distribution and suitable adhesion particle quantity. Finally, the tool feed adopts as 30 μm/min in micro-grinding process, the surface roughness reduces from 1.47 μm Rmax (0.2 μm Ra) to 0.462 μm Rmax (0.026 μm Ra) after micro-grinding.
    Table of Content 目錄
    中文摘要I
    英文摘要II
    謝  誌III
    目錄I
    圖目錄IV
    表目錄VII
    第一章 緒 論1
    1-1 研究動機1
    1-2 研究目的2
    第二章 基本原理介紹3
    2-1 放電加工基本原理3
    2-1-1 放電加工原理3
    2-1-2 放電加工的材料去除機制5
    2-1-3 放電加工參數與影響8
    2-2 線放電研磨加工原理11
    2-3 電鍍原理14
    2-3-1 電極電位(Electro Potential)15
    2-3-2 極化15
    2-3-3 電雙層16
    2-4 複合電鍍原理17
    2-5 界面活性劑原理與應用19
    第三章 實驗設備、材料及方法20
    3-1 實驗設備20
    3-1-1 放電加工機20
    3-1-2 送線機構23
    3-1-3 X-YTable 電極旋轉夾持機構24
    3-1-4 放電加工機加裝放電能量調節器25
    3-1-5 複合電鍍沉積機構25
    3-1-6 CCD(Charge Coupled Device)量測系統26
    3-1-7 超音波洗淨機26
    3-1-8 低真空掃瞄式電子顯微鏡(Low Vacuum-Scanning Electron Microscope:LVSEM)27
    3-1-9 去離子水系統27
    3-1-10 電源供應器27
    3-2 實驗材料28
    3-2-1 工件材料28
    3-2-2 工具電極材料29
    3-2-3 線電極材料29
    3-2-4 電鍍液30
    3-2-5 電解液32
    3-2-6 磨粒32
    3-3 實驗方法33
    3-4 實驗參數設定38
    3-4-1 工具電極放電加工參數38
    3-4-2 電解加工39
    3-4-3 複合電鍍沉積加工39
    3-4-4 高鎳合金微孔加工40
    3-4-5 複合電鍍沉積研磨加工41
    3-5 實驗流程42
    第四章 結果與討論43
    4-1 複合電鍍沉積之鍍層特性43
    4-1-1 製程參數對鍍層厚度之影響43
    4-1-2 CTAB對鍍層表面平整性之影響48
    4-1-3 鍍層基底之探討50
    4-2 鍍層表面磨粒附著51
    4-2-1 電流對鍍層表面磨粒附著之影響51
    4-2-2 陽極環孔徑對鍍層表面磨粒附著之影響53
    4-2-3 磨粒粒徑對鍍層表面磨粒附著之影響55
    4-2-4 工具轉速對鍍層表面磨粒附著影響58
    4-2-5 磨粒添加量對鍍層表面磨粒附著之影響60
    4-2-6 界面活性劑添加量對鍍層表面磨粒附著之影響62
    4-3 研磨加工後之工具磨耗與微孔表面特性65
    4-3-1 微型研磨工具之磨耗特性66
    4-3-2 磨粒粒徑對微孔研磨加工之影響67
    4-3-3 磨粒附著量對微孔研磨加工之影響68
    4-4 研磨加工前後孔壁表面之比較70
    第五章 結論72
    參考文獻73
    Reference 參考文獻
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    2. A. C. Wang, B. H. Yan, X. T. Li and F. Y. Huang “Use of micro ultrasonic vibration lapping to enhance the precision of microholes drilled by micro electro-discharge machining” 2002 International Journal of Machine Tools and Manufacture 42 915-923.
    3. H Huang, H Zhang, L Zhou and H Y Zheng “Ultrasonic vibration assisted electro-discharge machining of microholes in Nitinol “ 2003 J. Micromech. Microeng. 13 693–700.
    4. W. Ehrfeld and H. Lehr “Deep X-Ray Lithography for the production of three-dimensional microstructures from metals, polymers and ceramics” 1995 Radiat. Phys. Chem 45 3 349-365.
    5. R. K Kupka, F. Bouamrance, Cremers, Smegtert, Smegtert “Mircofabrication : LIGA-X and applications “ 2000 Applied Surface Science 164 1-4 97-110.
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    7. Bo Hyun Kim, Shi Hyoung Ryu, Deok Ki Choi and Chong Nam Chu “Micro electrochemical milling” 2005 J. Micromech. Microeng. 15 124–129.
    8. Gulielmi, N. “Kinetics of the Deposition of Inert Particles from Electrolytic Baths” 1972 Journal of the Electrochemical Society 119 8 1009-1012.
    9. Celis, J. P., Roos, J. R. and Buelens, C. “A Mathematical Model for the Electrolytic Codeposition of Particles with a Metallic Matrix” 1987 Journal of the Electrochemical Society 134 6 1402-1408.
    10. Hwang, B. J. and Hwang, C. S. “Mechanism of Codeposition of Silicon Carbide with Electrolytic Cobalt” 1993 Journal of the Electrochemical Society 140 4 979-984.
    11. Garcia, I., Fransaer, J., Celis, J. P., “Electrodeposition and Sliding Wear Resistance of Nickel Composite Coatings Containing Micron and Submicron SiC Particles” 2001 Surface & Coatings Technology 148 2-3 171-178.
    12. Marc De Vogelaere, Volkmar Sommer, Heike Springborn,Ursula Michelsen-Mohammadein “High-speed plating for electronic applications” 2001 Electrochimica Acta 47 1-2 109-116.
    13. James Q. Feng, Dan A. Hays “Relative importance of electrostatic forces on powder particles” 2003 Powder Technology 135-136 65-75.
    14. Nabeen K. Shrestha, Ichiro Miwa, and Tetsuo Saji,” Composite Plating of Ni/SiC Using a Cationic Surfactant with an Azobenzene Group” 2001 Journal of The Electrochemical Society, 148 2 C106-C109.
    Advisor
  • Biing-Hwa Yan(顏炳華)
  • Files
  • 93323030.pdf
  • approve in 1 year
    Date of Submission 2006-07-14

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