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Student Number 92523045
Author che-chun kuo(郭哲均)
Author's Email Address No Public.
Statistics This thesis had been viewed 2241 times. Download 1948 times.
Department Communication Engineering
Year 2004
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title 覆晶技術應用於毫米波積體電路
Date of Defense 2005-06-10
Page Count 116
Keyword
  • CPW filters
  • FlipChip
  • MMIC
  • Abstract 本論文成功利用覆晶式封裝技術(Flip Chip)成功研發出覆晶式微波積體電路( Flip Chip Microwave Integrated Circuit),所設計的電路中有20GHz 放大器 13.2GHz 振盪器,其放大器模擬約在20GHz有14dB的增益,量測增益為10dB,其振盪器模擬的頻譜在13.2GHz有10dBm的振盪功率,其量測大約漂到10GHz有0dBm的振盪功率。
    本論文又提供了30GHz全新縮小型低通濾波器(1.49mm x 1.6mm),大大改善歩階式阻抗低通濾波器(Step Impedance)耗費大量面積(2.35mm x 1.6mm),並且有更好的電路特性其縮小型S21於40GHz為-31dB傳統歩階式S21於40GHz為-22dB。
    在30GHz帶通濾波器我們提供了一個較為窄頻5GHz頻寬的,以及一個基本型和其對照ACPS(Asymmetric Coplanar Striplines),縮小面積佈局的帶通濾波器
    我們還研發主動電路的實現,利用CPW設計28GHz低雜訊放大器31GHz功率放大器,其增益模擬18dB於28GHz NF2.4dB,實際量測 16dB於26GHz NF3dB
    CPW設計的功率放大器其模擬增益18dB於31GHz,Pae於1dB 23%,Pout 20dBm,實際量測增益15dB於31GHz,Pout19dBm,Pae於1dB 20%
    Table of Content 第一章序1
    1.1序論1
    1.2論文架構2
    第二章共面波導濾波器設計4
    2.1共面波導的簡介,理論分析與製程方式4
    2.1.1共平面波導的簡介4
    2.1.2共平面波導的理論5
    2.1.3共平面波導的製作7
    2.2毫微米波共平面波導低通濾波器8
    2.2.1共平面步階式阻抗濾波器8
    2.2.2三種不同止帶極點設計13
    2.2.2.1A類低通濾波器15
    2.2.2.2B類低通濾波器17
    2.2.2.3C類低通濾波器19
    2.2.3縮小型低通濾波器設計                   22
    2.2.4止帶極點縮小型低通濾波器設計25
    2.2.5結論27
    2.3毫微米波共面波導帶通濾波器設計27
    2.3.1兩階帶通濾波器28
    2.3.2三階帶通濾波器31
    2.3.3三階ACPS帶通濾波器34
    2.4總結36
    第三章覆晶式(FLIP CHIP)封裝簡介38
       3.1覆晶式封裝製程流程38
    3.2凸塊(BUMP)製作40
    3.3凸塊(BUMP)分析與等效電路45
    3.4覆晶式主動元件分析55
    3.4總結58
    第四章覆晶式電路59
    4.1電路製程流程59
    4.2放大器電路設計65
    4.3振盪器電路設計69
    4.4總結76
    第五章毫微米波共面波導低雜訊放大器77
    5.1雜訊簡介77
       5.1.1基本雜訊理論77
    5.1.2雜訊指數定義79
    5.1.3雙埠網路之雜訊指數80
    5.2放大器設計81
    5.3量測結果85
    5.4總結88
    第六章毫微米波共面波導低功率放大器89
    6.1 功率放大器理論89
    6.1.1功率放大器分類89
    6.2電路設計93
    6.3量測結果95
    6.4總結97
    第七章結論98
    參考文獻              99
    附錄一共平面波導的公式推導104
    附錄二薄膜製程107
    附錄三最大平坦化低通濾波器元件值對照表109
    附錄四覆晶式電路製程110
    附錄五覆晶鍵結機(FlipChup Bonder)介紹116
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    Advisor
  • yi-jen chan(詹益仁)
  • Files
  • 92523045.pdf
  • approve immediately
    Date of Submission 2005-06-22

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