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Student Number 92344006
Author Shen-Jie Wang(H)
Author's Email Address s0324045@cc.ncu.edu.tw
Statistics This thesis had been viewed 1805 times. Download 614 times.
Department Chemical and Materials Engineering
Year 2005
Semester 2
Degree Ph.D.
Type of Document Doctoral Dissertation
Language English
Title Coupling Effects between Two Interfacial Soldering Reactions in Flip-Chip Solder Joint
Date of Defense 2006-05-04
Page Count 100
Keyword
  • Au bump
  • Flip-chip
  • interfacial reaction
  • Pb-free solder
  • Abstract It has been reported that as Ni and Cu bond pads are soldered to form a joint, Sn/Ni and Sn/Cu interfacial reactions would interact mutually, as reviewed in chapter 1. The dissolved Cu atoms from the Cu pad would move toward the Ni pad, then, a Cu-Sn compound layer formed on the Sn/Ni interface. In our previous study, the driving force of the migration of dissolved Cu atoms toward the Ni side has been proposed to attribute to the reduction of the Cu solubility near the Sn/Ni interface. This dissertation discusses the coupling effects between two interfacial reactions using a series of different metal/Sn/Cu sandwich structures. 
    In chapter 2, we further study the Cu diffusion mechanism in Ni/Sn/Cu sandwich structure. Using Ni/Sn/Cu sandwich sample, the mutual interaction between Sn/Ni and Sn/Cu interfacial reactions has been studied. On the Cu side, the major interfacial reaction product is Cu6Sn5, on the other hand, a ternary (Cu,Ni)6Sn5 compound layer formed on the Ni side. We found that the growth kinetics of the interfacial compound layers on the both sides would reach a steady-state in the late stage of reflow. The interfacial compound layer on the Cu side would remain a constant thickness. On the contrary, the interfacial compound layer on the Ni side grew in a relatively fast rate, which was found to be linear with time. Our results indicate that the growth of the ternary (Cu,Ni)6Sn5 compound layer was controlled by the Cu dissolution flux at the solder/Cu6Sn5 compound interface. The dissolution constant of the Cu6Sn5 compound into the molten Sn was determined to be 0.13 (
    Table of Content Abstract (in Chinese)                     I
    Abstract (in English)                     IV
    Contents                         VIII
    Figures Caption                       XI
    List of Tables                       XVI
    Chapter 1 Introduction
    1.1The Coupling Effects of Two Interfacial Reactions between Chip and Substrate side in Flip-chip Solder JointKKKKKKKKKKKKKKKKK..KK.KK1
    1.2ReviewKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKK2
    A.UBM on the substrate-side causes the spalling of Cu6Sn5 on the chip-side............2
    B.Five groups by pairing all the different surface finishesKKKKKKKKK.......3
    C.Sn/Cu/Sn/Ni/Sn/Cu/Sn reaction couple solid-state annealed at 200
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    Advisor
  • Cheng-Yi Liu(B)
  • Files
  • 92344006.pdf
  • approve immediately
    Date of Submission 2006-05-15

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