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Student Number 92343020
Author Jiuan-Hung Ke(柯俊宏)
Author's Email Address No Public.
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Department Mechanical Engineering
Year 2010
Semester 2
Degree Ph.D.
Type of Document Doctoral Dissertation
Language zh-TW.Big5 Chinese
Title Development of Elasticity Abrasive and it Application to Experimental Study on the mainly of Wafer by Abrasive Jet Technology
Date of Defense 2011-07-05
Page Count 128
Keyword
  • abrasive
  • compound abrasive
  • hetero layer removal
  • Abstract As the semiconductor industry due to increased demand for technology products and petrochemical crisis caused by the solar industry is flourishing under the influence of such environment, making use of the silicon wafer significant increase in the supply and demand imbalance under the derivative of the original problem of material shortage. Due process yield problems caused by discarded wafers will also increase its value, in terms of cost and resource re-use of relevant considerations, industry demand for wafers of increasing re-use, so the wafer surface treatment technology is urgently needed to break the subject . The traditional wafer surface treatment processes are still the environment of the processing of a number of issues need to be resolved.
    In this study, the environmental impact, process efficiency and other factors consideration, the select the for hard-brittle materials with better material removal rate of abrasive jet machining process method , but the traditional abrasive jet impact likely caused by over-processed surface is not smooth, merely to add subsequent treatment of the problems, this study developed a micro- elasticity compound abrasive, using its instant impact with the energy characteristics of the buffer, for abrasive jet machining method to remove the wafer surface hetero layer to improve the shortcomings, and with microscopic jet technology, can effectively improve the excessive processing and the surface roughness of the problem, thus reducing the cost of subsequent treatment processes.
    Study is divided into three parts, the first part of the composite abrasive of the preparation and processing: the use of physical heating coated with way the abrasive particles coated on the surface of polymer materials made of spherical composite abrasive, experimental proof of the set temperature of 200 ℃ and the availability of coated particle morphology # 3000, complete uniform composite coated abrasives. The results indicate indeed found to reduce the cracks derivative. The second part is the wafer recycling process: the surface hetero layer for wafer processing using experimental of design to explore the process parameters on surface roughness and material removal rate. The experimental results revealed that the better combination of process parameters: combination is Abrasive mesh size 3000 SiC、Impact angle 30°、stand-off distance 70mm、Impact pressure 0.4 MPa and rotation platform speed 250 rpm. The wafer surface hetero layer is completely removed within 5 minutes and the EDS examination confirms that there are no other elements remained and the result also achieves the surface roughness 0.118μm Ra. The experiment proves that the compound abrasive can completely remove the hetero layer on wafer surface and obtain the better surface roughness. The third part is the development of magnetic elasticity composite abrasive with the magnetic field assisted and then attracting effect, increasing the abrasive material removal efficiency, and improve utilization of abrasive, experimental results show that the use of chemical co-precipitation method to manufacture nano-magnetic powder coated with composite abrasive to form the magnetic-elasticity composite abrasive. It also combines a variety of material removal mechanism.
    Table of Content 摘  要i
    Abstractiii
    謝  誌v
    目  錄vi
    圖 目 錄ix
    表 目 錄xii
    第一章 緒論1
    1-1 研究背景1
    1-2 研究動機與目的4
    1-3 文獻回顧6
    1-3-1晶圓表面處理6
    1-3-2 磨料噴射加工法10
    1-3-3 田口實驗規劃13
    1-3-4反應曲面法15
    1-4 研究方法16
    1-5 論文架構18
    第二章 複合磨料之製備與加工性測試19
    2-1 前言19
    2-2 實驗設備與流程21
    2-2-1 實驗設備21
    2-2-2 實驗流程24
    2-3結果與討論25
    2-3-1 基材選擇25
    2-3-2 披覆磨料之溫度實驗25
    2-3-3 披覆磨料粒徑之影響26
    2-3-4 設定溫度之影響29
    2-3-5 披覆均勻性之關係30
    2-3-6 彈性複合磨料之成型觀測31
    2-4加工性測試32
    2-4-1 移除機制探討32
    2-4-2 定點噴射測試34
    2-4-3 單行程噴射測試38
    2-5 結論41
    第三章 彈性複合磨料之精微噴射技術42
    3-1 精微噴射技術參數組合42
    3-1-1 實驗設計設備與材料42
    3-1-2 實驗設計規劃43
    3-1-2-1 因子水準設定46
    3-1-2-2 直交表配置47
    3-1-3 實驗結果分析48
    3-1-3-1 因子效果回應分析48
    3-1-3-2 變異數分析(ANOVA)及F檢定(F-test)52
    3-1-3-3 多品質特性參數組合54
    3-1-4 驗證實驗55
    3-2 反應曲面實驗規劃57
    3-2-1 中央合成設計58
    3-3 單因子驗證62
    3-3-1 實驗規劃62
    3-3-2 噴射距離之影響63
    3-3-3 衝擊角度之影響65
    3-3-4 披覆粒徑之關係67
    3-3-5 噴射壓力之影響68
    3-3-6 平台轉速之影響70
    3-3-7 加工時間與粗糙度之關係71
    3-4 3D輪廓觀測與EDS 檢測73
    3-5 拉曼光譜分析75
    3-6 結論76
    第四章 磁彈性複合磨料應用於晶圓再生製程77
    4-1 磁場輔助磨料噴射技術77
    4-1-1 實驗設備與規劃78
    4-1-2 可行性分析與討論80
    4-2 磁彈性複合磨料86
    4-2-1 磁性奈米微粒製備87
    4-2-2 磁彈性複合磨料製備88
    4-3 磁彈性複合磨料應用於再生晶圓製程92
    4-3-1 參數定義及設定92
    4-3-2 實驗配置及結果95
    4-3-3 最適參數組合101
    第五章 結論103
    參考文獻105
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    Advisor
  • Biing Hwa Yan(顏炳華)
  • Files
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  • approve in 3 years
    Date of Submission 2011-07-24

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