Title page for 91521053


[Back to Results | New Search]

Student Number 91521053
Author Chung-Yuan Kuang(匡仲元)
Author's Email Address No Public.
Statistics This thesis had been viewed 2954 times. Download 2072 times.
Department Electrical Engineering
Year 2003
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title HBT large signal model and RF power amplifier design and package
Date of Defense 2004-06-17
Page Count 125
Keyword
  • HBT
  • model
  • package
  • power amplifier
  • Abstract In this thesis, the HBT device VBIC model established first of all used different measurement methods to extract DC and AC parameters. And then establish temperature model parameters and high frequency noise model to complete device model. and the model used load pull system to verify microwave power、intermodulation、adjacent channel power rate、different environment temperature power character.
    Two types power amplifier for 802.11a is designed and compensate PA for linearity and temperature. The PA used different active bias circuit individually to improve linearity and restrain power gain variation when environment temperature changed. The power amplifiers consider package assembly effect. So the circuit design include ESD prevent component.
    The package model establish used HFSS simulator and lumped element components in the end.
    Table of Content 第一章導論
    §1-1 研究動機
    §1-2 論文綱要
    第二章VBIC模型建立
    §2-1簡介
    §2-2 VBIC模型建立
    §2-2-1 VBIC模型介紹
    §2-2-2 直流參數分析
    §2-2-3寄生電阻之量測及萃取
    §2-2-3-1射極與集極寄生電阻
    §2-2-3-2基極寄生電阻
    §2-2-4 Gummel plot量測及萃取
    §2-2-4-1 順向Gummel plot量測及萃取
    §2-2-4-2 逆向Gummel plot量測及萃取
    §2-2-5 射極電流特性與電流增益β量測與直流參數萃取
    §2-2-6 接面電容量測及萃取
    §2-2-7傳輸時間參數粹取分析
    §2-2-8交流參數粹取分析
    §2-2-9溫度參數粹取分析
    §2-2-10 VBIC大信號參數及其物理意義
    §2-3 VBIC大信號模型驗證
    §2-3-1微波功率特性驗證分析
    §2-3-1-1 5.2GHz微波功率特性驗證
    §2-3-1-2 微波功率特性分析
    §2-3-2交叉調變線性度驗證分析
    §2-3-3鄰近通道功率比線性度驗證分析
    §2-3-4 不同環境溫度下功率特性驗證分析
    §2-3-5 高頻雜訊模型建立
    §2-4結果討論
    第三章 溫度補償微波功率放大器設計
    §3-1功率放大器設計原理簡介
    §3-2溫度補償機制原理及模擬
    §3-3兩級功率放大器設計模擬結果
    §3-3-1小信號及大信號模擬
    §3-3-1-1 功率級小信號及大信號模擬
    §3-3-1-2 驅動級小信號及大信號模擬
    §3-3-1-3 級間匹配
    §3-3-1-4穩定度模擬分析
    §3-3-1-5 兩級放大器小信號及大信號模擬
    §3-3-2變溫模擬分析
    §3-3-3交叉調變線性度模擬分析
    §3-3-4 ESD電路設計與封裝模擬
    §3-3-5電路佈局
    §3-4量測結果
    §3-5結果討論
    第四章 線性補償功率放大器設計
    §4-1線性補償機制原理及模擬
    §4-2兩級功率放大器設計模擬結果
    §4-2-1小信號及大信號模擬
    §4-2-2線性度模擬分析
    §4-2-2-1 交叉調變線性度模擬
    §4-2-2-2鄰近通道功率比線性度模擬
    §4-2-3ESD電路設計與封裝模擬
    §4-2-4電路佈局
    §4-3量測結果
    §4-4結果討論
    第五章 電路封裝量測及模型建立
    §5-1 QFN封裝簡介
    §5-2 PCB de-embedding方法及量測結果
    §5-2-1 PCB de-embedding方法介紹
    §5-2-2 5.8GHz線性微波放大器封裝量測結果
    §5-2-3 5.8GHz溫度補償微波放大器封裝量測結果
    §5-3 封裝模型建立及驗證
    §5-4 結果討論
    第六章 結論
    參考文獻
    Reference [1] Xiaochong Cao; Mcmacken, J.; Stiles, K.; Layman, P.; Liou, J.J.; Oritz-Conde, A.; Moinian, S.;“Comparison of the new VBIC and conventional Gummel-Poon bipolar transistor models Electron Devices,”IEEE Transactions on, Volume: 47 Issue: 2, Feb 2000
    [2] Tutt, M.;“GaAs based HBT large signal modeling using VBIC for linear power amplifier applications,”Bipolar/BiCMOS Circuits and Technology Meeting, 2000. Proceedings of the 2000, 2000
    [3] Cao, X.; McMacken, J.; Stiles, K.; Layman, P.; Liou, J.J.; Sun, A.; Moinian, S.;“Parameter extraction and optimization for new industry standard VBIC model,”Advanced Semiconductor Devices and Microsystems, 1998. ASDAM'98. Second International Conference on, 5-7 Oct
    1998
    [4] Huang, G.W.; Chen, K.M.; Kuan, J.F.; Deng, Y.M.; Wen, S.Y.; Chiu, D.Y.; Wang, M.T.;“Silicon BJT modeling using VBIC model,”Microwave Conference, 2001. APMC 2001. 2001
    Asia-Pacific, Volume: 1, 2001
    [5] Cherepko, S.V.; Hwang, J.C.M.;“VBIC model applicability and extraction procedure for InGap/GaAs HBT,”Microwave Conference, 2001. APMC 2001. 2001 Asia-Pacific, 2001
    [6] Najm, F.;“VBIC95: an improved bipolar transistor model,”IEEE Circuits and Devices Magazine, Volume: 12 Issue: 2,
    Mar 1996
    [7] McAndrew, C.C.; Seitchik, J.A.; Bowers, D.F.; Dunn, M.; Foisy, M.; Getreu, I.; McSwain, M.; Moinian, S.; Parker, J.; Roulston, D.J.; Schroter, M.; van Wijnen, P.; Wagner, L.F.;“VBIC95, the vertical bipolar inter-company model,”Solid-State Circuits, IEEE Journal of, Volume: 31
    Issue: 10, Oct 1996
    [8] 王雅萱,“異質接面雙極性電晶體VBIC模型建立及其在射頻電路之應用”,碩士論文, 國立中央大學, 2003
    [9] Dawson, D.E.; Gupta, A.K.; Salib, M.L.;“CW measurement of HBT thermal resistance,”Electron Devices, IEEE Transactions on ,Volume: 39 Issue: 10 , Oct 1992
    [10] Marsh, S.P.;“Direct extraction technique to derive the junction temperature of HBT's under high self-heating bias conditions,”Electron Devices, IEEE Transactions on , Volume: 47 Issue: 2, Feb 2000
    [11] Gray, Paul R.; Hurst, Paul J.; Lewis, Stephen H.; Meyer, Robert G.;2001. “Analysis and design of analog integrated circuits”John Wiley&Sons, U.S.A,:748-758.
    [12] Koji Yamanaka; Kazuhisa Yamauchi; Kazutomi Mori; Yukio Ikeda; Hiroshi Ikematsu; Naoki Tanahashi; Tadashi Takagi; “Ku-band Low Noise MMIC Amplifier with bias circuit for compensation of temperature dependence and process variation” Microwave Symposium Digest, 2002 IEEE MTT-S International, Volume: 3, 2-7 June 2002. Pages:1427 - 1430
    [13] Kim, J.H.; Noh, Y.S.; Park, C.S.; “Linearised HBT MMIC power amplifier with partially RF coupled active bias circuit for W-CDMA portable terminals applications” Electronics Letters, Volume: 39, Issue: 10, 15 May 2003 Pages:781 – 783
    [14] Cripps, Steve C.; 1999.“RF power amplifiers for wireless communications” Artech house, U.S.A,:181-190.
    [15] Yoshimasu, T.; Akagi, M.; Tanba, N.; Hara, S.;“An HBT MMIC power amplifier with an integrated diode linearizer for low-voltage portable phone applications” Solid-State Circuits, IEEE Journal of, Volume: 33,Issue: 9, Sept. 1998 Pages:1290 – 1296
    [16] Maas, S.A.; “Volterra analysis of spectral regrowth” IEEE Microwave and Wireless Components Letters, Volume: 7, Issue: 7,July 1997 Pages:192 – 193
    [17] 蘇珍儀,“C頻帶射頻電路設計及模組封裝”,碩士論文, 國立中央大學, 2003
    [18] Horng, T.S.; Wu, S.M.; Chiu, C.T.; Hung, C.P.; “Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages” IEEE Transactions on advance packaging, Volume: 24, Issue: 4,November 2001 Pages:548 – 554
    [19] Horng, T.S.; Wu, S.M.; Chiu, C.T.; Hung, C.P.; “Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs” IEEE Transactions on Microwave theory and techniques, Volume: 49, Issue: 9,September 2001 Pages:1538 – 1545
    [20] Johns, David A.; Martin, Ken.;1997. “Analog integrated circuit design”John Wiley&Sons, U.S.A,:181-217.
    [21] Ludwig, Reinhold.; Bretchko, Pavel.;2000. “RF circuit design theory and applications”Prentice Hall, U.S.A,:175-177
    Advisor
  • Yi-Jen Chan(詹益仁)
  • Files
  • 91521053.pdf
  • approve immediately
    Date of Submission 2004-06-23

    [Back to Results | New Search]


    Browse | Search All Available ETDs

    If you have dissertation-related questions, please contact with the NCU library extension service section.
    Our service phone is (03)422-7151 Ext. 57407,E-mail is also welcomed.