R.F.Pierret, “Semiconductor Device Fundamentals”,Addsion Wesley,
 Guillermo Gonozolez, “Microwave transistor amplifiers analysis and design”, Prentice-Hall, 1984.
 T.Yoshimasu, M. Akagi, N. Tanba, and S. Hara, “A Low Distortion and High Efficiency HBT MMIC Power Amplifier with A Novel Linearization Technique for Pi/4 DQPRK Modulation,” Gallium Arsenide Intergrated Circuit (GaAs IC) Symposium, pp.45, 1997.
 Y. S. Noh, T. W. Lee, C.S. Park, “Linearized high efficient HBT power amplifier modulate for L-band application,” Gallium Arsenide Intergrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest, pp.197, 2001.
 B. Razavi, “Design of Analog CMOS Integrated Circuits”, Mcgraw Hill, 1996.
 G. Gonzalez, “Microwave transistor Amplifier Analysis and Design”, Prentice Hall, 1994, p209.
 G.D Vendelin, A.M. Pavio, U.L. Rohade, “Microwave Circuit Design Using Linear and Nonlinear Techniques”, Wiley Interscience, 1990, Chapter 6.
 B. Razavi, “RF Microelectronics”, Prentice Hall, 1997.
 Gunhee Han and Edgar Sanchez-Sinencio, “CMOS Transconductance Multipliers: A Tutorial”, IEEE Trans. Circuits and System, Part II,vol. 45, pp.1550-1562, Dec.1998.
 T.H.Lee, The Design of Radio Frequency Integrated Circuit.
 B. Gilbert, “A precision for-quadrant multiplier with subnanosecond response”, IEEE J. Solid-State Circuit, vol. SC-3, pp.353-365, Dec. 1968.
 J. Chang, “An Integrated 900MHz Spread-Spectrum Wireless Receiver in 1-um CMOS and a Suspended Inductor Technique”, UCLA Ph.D disseration.
 S. Wu and B. Razavi, “A 900-MHz/1.8GHz CMOS Receiver for Dual-Band Application”, IEEE J. Solid-State Circuits, vol.33, pp.2178-2185, Dec. 1998.
 A. Rofougaran, James Y. C. Chang, M. Rofougaran, and A. A. Abidi, “A 1GHz CMOS RF Front-end IC for a Direct-conversion Wireless Receiver”, IEEE J. Solid State, vol. 31, pp.880-889, July. 1996.
 A. Magill, “CSP Present and Future” , International Symposium on Advanced Packaging Materials, 1999.
 “BCC(Bump Chip Carrier) technology”, technical report, R&D Engineering Div., Advanced Semiconductor Engineering, Inc.
 “Bump chip carrier technical brief” , www.fujitsumicro.com, Feb. 1999.
 T.S. Horng, S.M. Wu, C. Shih, “Electrical modeling of RFIC packages up to 12 GHz” , Proc 49th Electronic Components and Technology Conf., pp867-712, 1999.