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Student Number 89323044
Author CHANG-CHIH KUAN(官長治)
Author's Email Address s9323044@cc.ncu.edu.tw
Statistics This thesis had been viewed 2342 times. Download 2750 times.
Department Mechanical Engineering
Year 2001
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title Mathematic Modle Estimate of Temperature cycling for Electronic Products Failure
Date of Defense 2002-07-08
Page Count 80
Keyword
  • Electronic Products
  • Temperature cycling
  • Abstract This article investigates the effects of thermal cycling on the degradation of electronic products, such as components, small module and SMT welds. Three parameters including temperature range, heating rate and numbers of cycles are considered. From the results, the effect of normal thermal cycling condition on the components and small module is very small. The tensile strength of SMT welds decrease with increasing temperature range and heating rate. The relationship between tensile strength, temperature range, heating rate and numbers of cycles can be described by the modified inverse power law and modified Hughes equation for SMT welds.
    Table of Content 摘要I
    誌謝II
    總目錄III
    表目錄VI
    圖目錄IX
    符號說明XI
    第一章 緒論
    1- 1 研究動機與目的
    1- 2 文獻回顧
      1-2-1國內相關重要文獻
      1-2-2國外相關重要文獻
    第二章 理論說明
      2-1 溫度循環試驗
      2-1-1溫度循環所造成之熱疲勞
      2-2 溫度循環對於電子產品之影響
      2-3 溫度循環對於銲接點之影響
        2-3-1各種電子構裝銲接技術
    2-3-2電子構裝銲接點破壞機構
      2-4 溫度循環效應的數學模式
      2-5 田口實驗設計法簡介
    2-5-1品質損失函數
        2-5-2望大特性的S/N比
    第三章 實驗設備與步驟
      3-1 試件規格
      3-2 儀器設備
      3-3 溫度循環試驗之規劃
      3-4 實驗步驟
      3-5 田口實驗參數設計
       
    第四章 結果與討論
      4-1 電子產品之退化效應數學模式
        4-1-1 溫度範圍-溫變率-可靠度關係式
        4-1-2 溫度循環數學模式驗證
      4-2 各溫度循環參數之貢獻率
    4-2-1 訊號雜訊比之計算
    4-2-2 變異數分析
      
    第五章 結論
    參考文獻
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    Advisor
  • Jiun-ren Hwang(黃俊仁)
  • Files
  • 89323044.pdf
  • approve immediately
    Date of Submission 2002-07-18

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