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Student Number 88321041
Author Mei-Hui Wu(吳美慧)
Author's Email Address No Public.
Statistics This thesis had been viewed 2590 times. Download 2338 times.
Department Chemical and Materials Engineering
Year 2000
Semester 2
Degree Master
Type of Document Master's Thesis
Language zh-TW.Big5 Chinese
Title 含光敏感單體之甲基丙烯酸酯系列正型光阻之製備
Date of Defense 2001-07-13
Page Count 120
Keyword
  • 光阻
  • 感光性高分子
  • Abstract 本研究係以傳統的DNQ系列中的5-NDSC為光敏感基團,和甲基丙烯酸酯系列的單體進行共聚合,以製備具有良好物性且可應用於I-line(365nm)光源的正型光阻(Photo resist)。
    首先將光敏感物質(5-NDSC)分別與甲基丙烯酸(MAA)單體和甲基丙烯酸-2-羥基乙酯(2-HEMA)單體,在鹼性環境下進行酯化(Esterification)反應,並藉由繁複的純化步驟將產物純化,以合成光敏感單體(Photo active compound, PAC)PAC(A)(1,2-Naphthoquinone-2-diazido-5-sulfonyl methacrylic ester)和PAC(B)(2-ethoxyl(1,2-Naphthoquinone-2-diazido-5-sulfonyl) methacrylic ester)。而研究所得的產物藉由核磁共振光譜分析儀(NMR)、霍式轉換紅外線光譜分析儀(FTIR)和熱重分析儀(TGA),分析證明產物個別的結構與其物性確為預期目標。
    另外,利用微量注入法(Micro-injection)同時導入偶氮異二丁月青(AIBN)和正十二硫醇(12-thiol),和甲基丙烯酸(MAA)單體、甲基丙烯酸-2-羥基乙酯(2-HEMA)單體與甲基丙烯酸(3,3,5-三甲基)環己酯(TMCHMA)單體進行共聚合成為Binder(1)----THM樹脂基材,同於上述,只是將甲基丙烯酸(3,3,5-三甲基)環己酯單體置換成AdMA單體以進行共聚合成為Binder(2)----AHM樹脂基材。接著則將產物進行熱重分析儀(TGA),以便分析證明其物性確為預期目標。
    最後則個別將兩種不同的PAC分別和兩種不同的樹脂基材,在偶氮異二丁月青(AIBN)的起始下進行共聚合,因而得到四種不同結構的光阻(Photo resist)材料,而且產物轉化率極高。接著將實驗所得的產物進行波長365nm的I-line光源微影製程(Lithography)測試,並用光學顯微鏡觀察圖像(Pattern)型態,以確定其展現出正型光阻的特性。並將產物進行熱重分析儀(TGA)和掃瞄式電子顯微鏡(SEM)等儀器分析,結果顯示產物的物性、熱性質確實相當良好,而且微影結構的圖像尚可,證實本研究所製備的正型光阻材料確可應用於I-line光源的微影製程。
    由於本研究所採用的單體除了光敏感物質(5-NDSC)之外,其餘單體皆為甲基丙烯酸酯系列的結構,因此可以提供整個系統較佳的物理特性,而且系統中並無苯環結構的基團出現,因此可以降低傳統的DNQ/Novolak系統正型光阻在波長248nm地方會有強烈吸收的問題,所以實驗所得的產物除了可以應用於I-line光源之外,也可以應用於KrF(248nm)的光源系統。 
    [ 論文目次 ]
    Table of Content 目 錄
    目錄--------------------------------------------------------------------------------Ⅰ
    圖索引-----------------------------------------------------------------------------Ⅳ
    表索引-----------------------------------------------------------------------------Ⅷ
    第一章 緒論--------------------------------------------------------------------1
    第二章 實驗部分--------------------------------------------------------------25
    2-1. 實驗藥品-------------------------------------------------------------25
    2-2. 實驗儀器-------------------------------------------------------------27
    2-3. 敏感單體的合成-------------------------------------------------28
    2-3-1. PAC(A)的合成-----------------------------------------------------28
    2-3-2. PAC(B)的合成----------------------------------------------------28
    2-4. 光敏感單體的純化---------------------------------------------------28
    2-4-1. PAC(A)的純化----------------------------------------------------29
    2-4-2. PAC(B)的純化----------------------------------------------------29
    2-5. AdMA單體的合成-------------------------------------------------29
    2-6. AdMA單體的純化--------------------------------------------------30
    2-7. 樹脂基材(Binder)的聚合---------------------------------------30
    2-7-1. Binder(1)----THM樹脂的聚合--------------------------------30
    2-7-2. Binder(2)----AHM樹脂的聚合---------------------------------31
    2-8. 光阻高分子的聚合---------------------------------------------------31
    2-8-1. PR(A1)的聚合---------------------------------------------------31
    2-8-2. PR(A2)的聚合----------------------------------------------------31
    2-8-3. PR(B1)的聚合----------------------------------------------------31
    2-8-4. PR(B2)的聚合----------------------------------------------------32
    2-9. 微影製程的測試------------------------------------------------------33
    2-9-1. 清潔晶圓(Clean)-------------------------------------------------33
    2-9-2. 旋轉塗佈(Spin coating)----------------------------------------33
    2-9-3. 軟烤(Soft-bake)--------------------------------------------------33
    2-9-4. 曝光(Exposure)--------------------------------------------------33
    2-9-5. 顯影(Development)---------------------------------------------33
    2-10. 物性測試---------------------------------------------------------------35
    2-10-1. 核磁共振光譜測定(Nuclear Magnetic Resonance Spectroscopy, NMR)------------------------------------------------------------------35
    2-10-2. 熱重分析儀(Thermogravimetric Analyzer, TGA)測試熱裂解點-----------------------------------------------------------------------35
    2-10-3. 霍氏轉換紅外光譜儀測定(Fourier-Transform Infrared Spectrometer, FTIR)材料結構-------------------------------------35
    2-10-4. 掃描式電子顯微鏡分析(Scanning Electron Microscopy, SEM)表面型態------------------------------------------------------36
    第三章 結果討論--------------------------------------------------------------37
    3-1. 光敏感單體的合成條件探討--------------------------------------37
    3-1-1. PAC(A)的合成條件探討--------------------------------------37
    3-1-2. PAC(B)的合成條件探討---------------------------------------45
    3-1-3. 兩種不同光敏感單體的性質比較--------------------------------53
    3-2. AdMA單體的合成條件探討------------------------------------55
    3-3. 樹脂基材(Binder)的聚合條件探討-------------------------60
    3-3-1. Binder(1)----THM樹脂的聚合條件探討---------------------60
    3-3-2. Binder(2)----AHM樹脂的聚合條件探討---------------------65
    3-3-3. 兩種不同樹脂基材的性質比較-----------------------------------70
    3-4. 光阻聚合的探討----------------------------------------------------72
    3-4-1. PR(A1)的聚合條件探討---------------------------------------72
    3-4-2. PR(A2)的聚合條件探討--------------------------------------81
    3-4-3. PR(B1)的聚合條件探討-------------------------------------90
    3-4-4. PR(B2)的聚合條件探討-------------------------------------99
    3-4-5. 四種不同配方的光阻性質比較-------------------------------107
    第四章 結論-----------------------------------------------------------------114
    第五章 參考文獻------------------------------------------------------------116
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    Date of Submission 2001-07-13

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